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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Specification XZ10150
Preliminary spec.
SSC
Drawn Kang Seok Jin 2008.10.17 Approval Pyo Byoung ki 2008.11.21
CUSTOMER
Approval
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
CONTENTS
1. 2. 3. 4. 5. 6. 7. 8. 9. Full code of Z-power LED series Feature & Application Absolute Maximum Ratings Electro Characteristics Outline Dimension Optical characteristics Packing Soldering Precaution for use
10. Handling of Silicone Resin LEDs
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
1. Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 X7 - X8 X9 -X10X11 X12 X13X14 1. Part Number - X1 : Color - X2 : New Z-Power LED - `Z' - X3 : New Z-Power LED series number - X4 : LENS type - X5 : Chip quantity (or Power Dissipation) - X6 : Package outline size -X7: Type of PCB 2. Internal Number - X8 - X9 3. Code Labeling - X10 : Luminous flux (or Radiant flux for royal blue) - X11 X12 X13: Dominant wavelength (or x,y coordinates rank code) - X1 4: Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag
PART NO. : X1 X2 X3 X4 X5 X6 X7 - X8 X9 QUANTITY : ### LOT NUMBER : ########## BIN CODE : X10 X11 X12 X13 X14
For more information about binning and labeling, refer to the Application Note -1
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Technical Data Sheet
XZ10150
Description
Z-Power series is designed for high current operation and high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general Illumination applications, custom designed solutions, automotive large LCD backlights
Z1
Features
* Super high Flux output and high Luminance * Designed for high current operation * Low thermal resistance * SMT solderbility * Lead Free product * RoHS compliant
Applications
* Mobile phone flash * Automotive interior / exterior lighting * Automotive signal lighting * Automotive forward lighting * General Torch * Architectural lighting * LCD TV / Monitor Backlight * Projector light source * Traffic signals * Task lighting * Decorative / Pathway lighting * Household appliances
* Remote / Solar powered lighting
*The appearance and specifications of the product may be changed for improvement without notice.
Rev. 00 December 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
3.Absolute maximum ratings
3-1. Pure White (WZ10150)
Symb ol IF Pd Tj Topr Tstg -
Parameter
Value 450(@ Tj = 90 C)
[1]
Unit
Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[2]
800(@ Pulse width 10ms, 1/10 duty) 2.16 125 -30 ~ +85 -40 ~ +100 10,000V HBM
mA W C C C -
4. Electric & Optical characteristics
1-1 Electro-Optical characteristics at IF=400mA, TA=25C Parameter Luminous Flux
[3] [5]
Symbol V [4] CCT Ra
[6]
Value Min Typ 105 6300 68 4.2 120 16.5 11 Max 4.8
Unit lm K V deg. C /W C /W
Correlated Color Temperature CRI Forward Voltage View Angle Thermal resistance Thermal resistance
[7] [8]
VF 2 1/2 RJ-B RJ-C
*Notes : [1] IF Max is guaranteed under the TJ 90 C. [2] It is included the zener chip to protect the product from ESD. [3] SSC maintains a tolerance of 10% on flux and power measurements. [4] V is the total luminous flux output as measured with an integrated sphere. [5] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance. [6] A tolerance of 0.06V on forward voltage measurements [7], [8] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. (25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC. * All measurements were made under the standardized environment of SSC
--------------------------Caution--------------------------
Rev. 01 www.ZLED.com
Please do not drive at rated current more than 5 sec. without proper heat sink November 2008
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
3.Absolute maximum ratings
3-1. Warm White (NZ10150)
Parameter Symb ol IF Pd Tj Topr Tstg Value 450(@ Tj = 90 C)
[1]
Unit
Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[2]
800(@ Pulse width 10ms, 1/10 duty) 2.16 125 -30 ~ +85 -40 ~ +100 10,000V HBM
mA W C C C -
4. Electric & Optical characteristics
4-1 Electro-Optical characteristics at IF=400mA, TA=25C Parameter Luminous Flux
[3] [5]
Symbol V [4] CCT Ra
[6]
Value Min Typ 80 3000 80 4.2 120 16.5 11 Max 4.8
Unit lm K V deg. C /W C /W
Correlated Color Temperature CRI Forward Voltage View Angle Thermal resistance Thermal resistance
[7] [8]
VF 2 1/2 RJ-B RJ-C
*Notes : [1] IF Max is guaranteed under the TJ 90 C. [2] It is included the zener chip to protect the product from ESD. [3] SSC maintains a tolerance of 10% on flux and power measurements. [4] V is the total luminous flux output as measured with an integrated sphere. [5] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance. [6] A tolerance of 0.06V on forward voltage measurements [7], [8] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. (25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC. * All measurements were made under the standardized environment of SSC
--------------------------Caution--------------------------
Rev. 01 www.ZLED.com
Please do not drive at rated current more than 5 sec. without proper heat sink November 2008
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5.Outline Dimension
1. Flat Type
[Package Outlines] [Bottom VIEW]
Cathode Mark
[Top VIEW]
Cathode Pad
Thermal Pad Anode Pad
[Front VIEW]
[Circuit Diagram]
[Recommended Solder Pad]
Anode
Cathode
Notes : 1. 2. 3. 4. All dimensions are in millimeters. (tolerance : 0.2 ) Scale : none Thermal pad is isolated. Paste thickness:(0.20.05)mm
*The appearance and specifications of the product may be changed for improvement withoutRev. 01 notice.
November 2008 www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Average Forward Current [mA]
Relative Lumious Flux(a.U)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Optical characteristics
6-1. Forward Voltage vs. Forward Current, TA=25
500
Pure White Warm White
400
300
200
100
0
0
1
2
3
4
5
6
Forward Voltage [V]
6-2. Forward Current vs. Normalized Relative Luminous Flux TA=25
1.2
1.0
Pure White Warm white
0.8
0.6
0.4
0.2
0.0 0 100 200 300 400 500
Forward Current [mA]
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Current [mA]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-3. Ambient Temperature vs Allowable Forward Current 1. Pure White,Warm white (TJMAX = 125 , 400mA)
500
400
300
RjaT = 20 C/W RjaT = 30 C/W
o o
o
200
RjaT = 40 C/W
100
0
0
25
50
75
o
100
125
Ambient Temperature [ C]
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Relative luminous flux
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-4. Typical Flat Type Radiation pattern 1. Pure White, Warm white
1.0
0 30
0.8
0.6
60
0.4
0.2
0.0 -80 -60 -40 -20 0
90
Angle(deg.)
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Spectral Power Distribution
Relative Intensity
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-5. color spectrum, TA=25C 1. Pure White
1.0
Standard eye response curve
0.8
0.6
0.4
0.2
0.0 300
400
500
600
700
800
Wavelength (nm)
2. Warm White
1.0
0.8
0.6
0.4
0.2
0.0 300
400
500
600
700
800
Dominant Wavelength
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Light Output [%]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-6. Relative Light Output vs. Junction Temperature at IF=400mA, TA=25
160 140 120 100 80 60 40 20 0 20
WZ10150 NZ10150
40 60 80 100
o
120
140
Junction Temperature, TJ [ C]
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Forwrd Voltage(Vf)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-7. Forward Voltage
5.0
vs Junction Temperature at IF=400mA, TA=25
Pure White Warm white
4.5
4.0
3.5
3.0 0 20 40 60 80 100 120
o
140
Junction Temperature, TJ [ C]
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Forwrd Voltage(Vf)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6-8. Forward Voltage
vs Forward Current, TA=25
6
Pure White Warm white
4
2 0 100 200 300 400 500 600
Foward Current(mA)
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Note: 1)Quantity : 500 or 1000pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 5) The appearance and specifications of the product may be changed for improvement without notice.
0.2
0.4
0.6
0.8
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
7. Packing
0.8 0.6 0.4 0.2
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Reel Packing Structure
Reel
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) TYPE SIZE (mm) a c b 245 220 102 7inch 245 220 142
1 SIDE c
TUV
MADE IN KOREA
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Acriche
RoHS
1
Semiconductor EcoLight
b a
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
150
~
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
8. Soldering
1. Reflow Soldering Conditions / Profile
260 240 220 200
Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min)
180
Pre-heating
Rising 5 C/sec
Cooling -5 C/sec
0 Time [Hr]
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280 Slug : Use a thermal-adhesives
* Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
9. Precaution for use
* Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. * Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40 Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 605 * Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. * Please avoid rapid cooling after soldering. * Components should not be mounted on warped direction of PCB. * Anti radioactive ray design is not considered for the products listed here in. * Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. * This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. * When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. * LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. * The appearance and specifications of the product may be modified for improvement without notice. * Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. * The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. * Attaching LEDs, don't use adhesives to generate organic vapor.
Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)

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